A copper (Cu) sputtering target is a solid metal source used in physical vapor deposition (PVD). During sputtering, energetic ions bombard the target surface, ejecting copper atoms that condense onto a substrate to form a thin metallic film. Copper belongs to the group of conductive transition metals and is widely studied for its electrical and thermal properties.
- Quantity: 1 piece
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- Deposition of conductive copper thin films for microelectronics and interconnect research
- Seed layer preparation for electroplating processes in semiconductor and packaging studies
- Metallization of substrates for electrode and contact development in laboratory devices
- Fabrication of reflective and decorative metallic coatings on glass and polymers
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