This iron (Fe) sputtering target from Nanografi has a purity of 99.95%, a size of 2'' and a thickness of 0.125''. It is supplied as a single piece and serves as the source material for depositing iron thin films by sputtering.
In sputter deposition, material is eroded from the target and deposited onto a substrate such as a silicon wafer. The method works on substrates of many shapes and sizes, gives repeatable results, and can move from small research and development work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. The large number of adjustable parameters makes sputtering a complex process, but it gives experienced users close control over film growth and microstructure.
- Deposition of iron thin films onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is needed and selectivity is not a concern.
- Analytical work that etches away target material, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research and development projects that may later be scaled up to production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01FE05
- Material: Iron (Fe)
- Size: 2''
- Thickness: 0.125''
- Product code: NG0ST01FE05
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