This iron (Fe) sputtering target from Nanografi is a 2'' target, 0.250'' thick, with a purity of 99.95%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established thin film technique that works with many materials and with substrates of varied shapes and sizes. The process is repeatable and can grow from small research and development work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. Although these many variables make sputtering a complex process, they give experienced users fine control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect trace impurities.
- Research related to space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01FE08
- Material: Iron (Fe)
- Size: 2''
- Thickness: 0.250''
- Product code: NG0ST01FE08
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