This iron oxide (Fe3O4) sputtering target from Nanografi is a 99.9% purity source material for depositing thin films by sputtering. It measures 4'' in size with a thickness of 0.250'' and is supplied as a single piece.
In sputter deposition, material is eroded from the target and transferred onto a substrate such as a silicon wafer. The technique works with substrates of many shapes and sizes, gives repeatable results, and scales from small R&D experiments to production batches covering medium to large substrate areas.
Depending on process settings, chemical reactions may take place at the target surface, in flight or on the substrate. Although the number of adjustable parameters makes sputtering a complex process, it gives experienced users considerable control over film growth and microstructure.
- Deposition of iron oxide thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not critical.
- Analytical work such as secondary ion mass spectrometry (SIMS), where material is sputtered at a constant rate to determine composition and trace impurities.
- Scaling sputtering processes from small research projects to production batches on medium to large substrate areas.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01FE23
- Material: Iron Oxide (Fe3O4)
- Size: 4''
- Thickness: 0.250''
- Product code: NG0ST01FE23
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