This iron oxide (Fe3O4) sputtering target from Nanografi is a 6'' target with a thickness of 0.125'' and a purity of 99.9%. It serves as the source material for depositing iron oxide thin films by sputtering, where material is eroded from the target and deposited onto a substrate such as a silicon wafer.
Sputter deposition is an established, repeatable technique that works with a wide range of substrate shapes and sizes. It scales from small research and development work up to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place at the target surface, in flight or on the substrate.
Because the process involves many adjustable parameters, experienced users gain considerable control over film growth and microstructure, making sputtering targets suitable for both exploratory and production-oriented thin film work.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity concentrations.
- Research related to space weathering processes affecting airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01FE26
- Material: Iron Oxide (Fe3O4)
- Size: 6''
- Thickness: 0.125''
- Product code: NG0ST01FE26
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