This lead (Pb) sputtering target from Nanografi has a purity of 99.99+%, a size of 1'' and a thickness of 0.250''. It serves as the source material for depositing thin lead films by sputtering, where material is eroded from the target and deposited onto a substrate such as a silicon wafer.
Sputter deposition works with many materials and with substrates of varied shapes and sizes. The process is repeatable, suits small research and development work, and can be scaled to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Because so many parameters are involved, the process is complex, but it gives experienced users considerable control over film growth and microstructure.
- Deposition of thin lead films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS) for determining composition and detecting very low impurity levels.
- Research on space weathering, in which sputtering alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99+% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01LE03
- Material: Lead (Pb)
- Size: 1''
- Thickness: 0.250''
- Product code: NG0ST01LE03
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