This magnesium fluoride (MgF2) sputtering target is a 1'' disc, 0.250'' thick, with a purity of 99.9%. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established method for coating substrates of many shapes and sizes. The process is repeatable and scales from small research and development work up to production batches covering medium to large substrate areas. Depending on process settings, chemical reactions may take place on the target surface, in flight or on the substrate.
Because sputter deposition involves many adjustable parameters, it is a complex technique, but this gives experienced users considerable control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Studies related to space weathering of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MG28
- Material: Magnesium Fluoride (MgF2)
- Size: 1''
- Thickness: 0.250''
- Product code: NG0ST01MG28
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