This magnesium oxide (MgO) sputtering target from Nanografi has a purity of 99.95%, a size of 2'' and a thickness of 0.250''. It is supplied as a single piece and serves as the source material for depositing thin films by sputtering.
In sputter deposition, material is eroded from the target and deposited onto a substrate such as a silicon wafer. The method works with many substrate shapes and sizes, gives repeatable results, and can move from small research and development work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Because so many parameters can be adjusted, sputtering is a complex process, but it gives experienced users close control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, as in secondary ion mass spectroscopy (SIMS), to determine composition and detect very low impurity levels.
- Research and development work that can later be scaled up to production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MG43
- Material: Magnesium Oxide (MgO)
- Size: 2''
- Thickness: 0.250''
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