This manganese (Mn) sputtering target from Nanografi has a purity of 99.95%, a diameter of 1'' and a thickness of 0.125'', and is supplied with indium. It serves as the source material in sputter deposition, where material is eroded from the target and laid down as a thin film on a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes with thin films. The process is repeatable and suits small research and development work as well as production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Because so many parameters can be adjusted, experienced users gain close control over film growth and microstructure.
- Thin film deposition of manganese onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by sputtering, for example in secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MN11
- Material: Manganese (Mn)
- Size: 1''
- Thickness: 0.125''
- Bonding: Indium
- Product code: NG0ST01MN11
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