This manganese (Mn) sputtering target from Nanografi has a purity of 99.95%, a size of 1'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes with thin films. The process is repeatable and scales from small research and development work up to production batches covering medium to large substrate areas. Depending on process conditions, chemical reactions may take place at the target surface, in flight or on the substrate.
Because sputter deposition involves many adjustable parameters, it is a complex technique, but it gives experienced users considerable control over film growth and microstructure. Each order contains one piece.
- Deposition of manganese thin films onto substrates such as silicon wafers.
- Sputter etching where strong etching anisotropy is required and selectivity is not critical.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Scaling thin film processes from research and development to medium and large substrate production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MN01
- Material: Manganese (Mn)
- Size: 1''
- Thickness: 0.125''
- Product code: NG0ST01MN01
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