This manganese (Mn) sputtering target from Nanografi has a purity of 99.9%, a size of 2'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat a wide range of substrate shapes and sizes. It gives repeatable results and scales from small research and development work to production batches covering medium to large substrate areas. Depending on the process parameters, chemical reactions can take place on the target surface, in flight, or on the substrate. The number of adjustable parameters makes the process complex, but it gives experienced users close control over film growth and microstructure.
- Deposition of manganese thin films onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not a concern.
- Materials analysis by etching away target material, for example in secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
- Research into sputtering as a form of space weathering on airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MN04
- Material: Manganese (Mn)
- Size: 2''
- Thickness: 0.250''
- Product code: NG0ST01MN04
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