This molybdenum disilicide (MoSi2) sputtering target from Nanografi has a purity of 99.95%, a size of 2'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes, and the process is repeatable. It scales from small research and development work to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place at the target surface, in flight or on the substrate.
Because sputter deposition involves many adjustable parameters, it is a complex process, but it gives experienced users considerable control over film growth and microstructure.
- Deposition of MoSi2 thin films onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is required and selectivity is not a concern.
- Analytical work such as secondary ion mass spectrometry (SIMS), where material is sputtered at a constant rate to determine composition and detect trace impurities.
- Research related to space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MO26
- Material: Molybdenum Disilicide (MoSi2)
- Size: 2''
- Thickness: 0.250''
- Product code: NG0ST01MO26
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