This molybdenum disilicide (MoSi2) sputtering target from Nanografi has a purity of 99.95%, a size of 4'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established way to coat substrates of many shapes and sizes. The process is repeatable, works for small research and development projects, and can be scaled to production batches covering medium to large substrate areas. Depending on the process settings, chemical reactions may take place at the target surface, in flight, or on the substrate itself.
Because sputter deposition involves many adjustable parameters, it gives experienced users considerable control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, for example in secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MO29
- Material: Molybdenum Disilicide (MoSi2)
- Size: 4''
- Thickness: 0.125''
- Product code: NG0ST01MO29
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