This molybdenum disulfide (MoS2) sputtering target from Nanografi has a purity of 99.9%, a size of 2'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes. The process is repeatable, so work started in small research and development projects can be scaled up to production batches covering medium to large substrate areas.
Depending on process parameters, chemical reactions may take place on the target surface, in flight, or on the substrate. The number of adjustable parameters makes sputtering a complex technique, but it gives experienced users considerable control over film growth and microstructure.
- Deposition of MoS2 thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
- Research into sputtering as a form of space weathering on airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MO35
- Material: Molybdenum Disulfide (MoS2)
- Size: 2''
- Thickness: 0.125''
- Product code: NG0ST01MO35
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