This molybdenum disulfide (MoS2) sputtering target from Nanografi has a purity of 99.9%, a size of 3'' and a thickness of 0.125''. It is supplied as a single piece and serves as the source material for depositing MoS2 thin films by sputtering.
In sputter deposition, material is eroded from the target and transferred onto a substrate such as a silicon wafer. The technique works with many substrate shapes and sizes, gives repeatable results, and can grow from small research and development work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Although the large number of variables makes sputtering a complex process, it also gives experienced users close control over film growth and microstructure.
- Thin film deposition of MoS2 onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is required and selectivity is not a concern.
- Materials analysis by sputtering, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research related to space weathering, where sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MO37
- Material: Molybdenum Disulfide (MoS2)
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST01MO37
—
—