This molybdenum disulfide (MoS2) sputtering target from Nanografi has a purity of 99.9%, a size of 3'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes with thin films from a broad range of materials. The process is repeatable, works well for small research and development projects, and can be scaled to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Although the large number of variables makes sputter deposition complex, it gives experienced users close control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, for example in secondary ion mass spectrometry (SIMS) to determine composition and detect very low impurity levels.
- Research related to space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MO38
- Material: Molybdenum Disulfide (MoS2)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01MO38
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