This molybdenum (Mo) sputtering target from Nanografi has a purity of 99.95%, a size of 8'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes with films of many different materials. The process is repeatable, so work started at small research and development scale can be carried forward to production batches covering medium to large substrate areas.
Depending on the process settings, chemical reactions may take place on the target surface, in flight or on the substrate. The large number of adjustable parameters makes sputtering demanding, but it gives experienced users close control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers by sputtering.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, for example in secondary ion mass spectroscopy (SIMS) to determine composition and detect very low impurity levels.
- Scaling sputter processes from research and development projects to medium and large substrate production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01MO11
- Material: Molybdenum (Mo)
- Size: 8''
- Thickness: 0.125''
- Product code: NG0ST01MO11
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