This nickel chromium (Ni-Cr) sputtering target is a source material for depositing thin films by sputtering. It has a purity of 99.95%, a size of 3'' and a thickness of 0.250'', and is supplied as a single piece.
In sputter deposition, material is eroded from the target and deposited onto a substrate such as a silicon wafer. The method works with many materials and with substrates of varied shapes and sizes. It gives repeatable results and can grow from small research projects to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. Because so many parameters are involved, the process is complex, but it gives experienced users close control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is required and selectivity is not a concern.
- Analytical work in which material is etched away, such as secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
- Research related to space weathering, which alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI42
- Material: Nickel Chromium (Ni-Cr)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01NI42
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