This nickel (Ni) sputtering target is a 1'' disc, 0.125'' thick, made from nickel with a purity of 99.995%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film on a substrate such as a silicon wafer.
Sputtering is an established route for coating substrates of many shapes and sizes. The process is repeatable and can grow from small R&D work to production batches covering medium to large substrate areas. Depending on process settings, reactions may take place at the target surface, in flight or on the substrate, and the many adjustable parameters give experienced users close control over film growth and microstructure.
Beyond film deposition, sputter targets are also used in sputter etching and in analytical techniques that remove target material at a controlled rate.
- Deposition of thin nickel films onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Analysis by secondary ion mass spectrometry (SIMS), where sputtered atoms are identified and quantified to determine composition and trace impurities.
- Research on space weathering, the sputtering process that alters airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.995% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI03
- Material: Nickel (Ni)
- Size: 1''
- Thickness: 0.125''
- Product code: NG0ST01NI03
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