This nickel (Ni) sputtering target from Nanografi has a purity of 99.9%, a size of 2'' and a thickness of 0.125''. It is supplied as a single piece for depositing nickel thin films by sputtering.
In sputter deposition, material is eroded from the target and deposited onto a substrate such as a silicon wafer. The method works with many substrate shapes and sizes, gives repeatable results, and scales from small R&D work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions can take place at the target surface, in flight or on the substrate. Because so many parameters can be tuned, experienced users have considerable control over film growth and microstructure.
- Deposition of nickel thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not critical.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Scaling sputter processes from research and development projects to production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI04
- Material: Nickel (Ni)
- Size: 2''
- Thickness: 0.125''
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