This Nickel (Ni) sputtering target from Nanografi is a 99.99% pure nickel source measuring 2'' in size with a thickness of 0.125''. It serves as the source material in sputter deposition systems, where atoms are ejected from the target and deposited as a thin film on a substrate such as a silicon wafer.
Sputter deposition is a well-established method for coating substrates of many shapes and sizes. Results are repeatable, and a process developed in small-scale research can be scaled to production batches covering medium to large substrate areas.
Depending on process settings, chemical reactions may take place at the target surface, in flight or on the substrate. Although the large number of variables makes sputtering a complex technique, they give experienced users fine control over film growth and microstructure.
- Deposition of thin nickel films onto substrates such as silicon wafers.
- Sputter etching in semiconductor processing where high etching anisotropy is required and selectivity is not critical.
- Surface analysis techniques such as secondary ion mass spectrometry (SIMS), where sputtered atoms are measured to determine composition and trace impurities.
- Research related to space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI05
- Material: Nickel (Ni)
- Size: 2''
- Thickness: 0.125''
- Product code: NG0ST01NI05
—
—