This nickel (Ni) sputtering target from Nanografi is a 99.9% purity source material for sputter deposition. It measures 2'' in size with a thickness of 0.250'' and is supplied as a single piece.
Sputtering builds thin films by eroding material from the target and depositing it onto a substrate such as a silicon wafer. The method works with substrates of many shapes and sizes, gives repeatable results, and scales from small R&D work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. Although the large number of variables makes sputter deposition complex, it gives experienced users considerable control over film growth and microstructure.
- Thin film deposition of nickel onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS) to determine composition and detect trace impurities.
- Research related to space weathering processes on airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI07
- Material: Nickel (Ni)
- Size: 2''
- Thickness: 0.250''
- Product code: NG0ST01NI07
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