Nickel (Ni) sputtering targets are solid metallic plates used as the source material in physical vapor deposition (PVD) sputtering systems. During sputtering, energetic ions bombard the target surface and eject nickel atoms that condense onto a substrate to form a thin film. As a transition metal target, it belongs to the class of metallic sputtering materials used in thin-film research and manufacturing.
- 1 piece
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- Deposition of nickel thin films for electronic and microelectronic research
- Magnetic thin-film and spintronic device studies
- Metallic adhesion or seed layers in multilayer coating stacks
- Development of protective and corrosion-resistant coatings
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