This Nanografi nickel (Ni) sputtering target has a purity of 99.9%, a size of 3'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat thin films onto substrates of many shapes and sizes. The process is repeatable, works for small research and development projects, and can be scaled up to production batches covering medium to large substrate areas.
Depending on the process settings, chemical reactions may take place at the target surface, in flight or on the substrate. The large number of adjustable parameters makes sputtering a complex technique, but it gives experienced users a high level of control over film growth and microstructure.
- Thin film deposition of nickel onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Analytical work such as secondary ion mass spectrometry (SIMS), where sputtered atoms are measured to determine composition and detect very low impurity levels.
- Research related to space weathering, in which sputtering alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI13
- Material: Nickel (Ni)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01NI13
—
—