This nickel (Ni) sputtering target from Nanografi has a purity of 99.99%, a size of 3'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputter deposition can coat substrates of many shapes and sizes, and the process is repeatable. It works for small research and development projects and can be scaled up to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions can take place on the target surface, in flight or on the substrate. The many adjustable parameters give experienced users considerable control over film growth and microstructure.
- Thin film deposition of nickel onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching away target material, as in secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research related to space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI14
- Material: Nickel (Ni)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01NI14
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