This nickel (Ni) sputtering target from Nanografi is a 6'' disc-format source with a thickness of 0.125'' and a purity of 99.995%. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established way to coat substrates of many shapes and sizes. The process is repeatable, works for small R&D runs and can be adapted to production batches covering medium to large substrate areas. Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate, and the many adjustable parameters give experienced users close control over film growth and microstructure.
Beyond film deposition, sputtering is also used for anisotropic etching and for surface analysis techniques such as secondary ion mass spectrometry (SIMS).
- Deposition of nickel thin films onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is required and selectivity is not a concern.
- Material analysis by SIMS, in which sputtered atoms are identified and quantified by mass spectrometry to determine composition and trace impurities.
- Scaling thin film processes from research and development work to medium and large substrate production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.995% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI25
- Material: Nickel (Ni)
- Size: 6''
- Thickness: 0.125''
- Product code: NG0ST01NI25
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