Nickel (Ni) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD) sputtering systems. Nickel is a transition metal valued for its magnetic, catalytic, and corrosion-resistant properties. During sputtering, energetic ions bombard the target surface and eject nickel atoms, which condense onto a substrate to form a uniform thin film.
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- Electrode and interconnect layers in electronic device research
- Magnetic thin-film studies for data storage and sensor development
- Corrosion-resistant and decorative coating development
- Seed or adhesion layers in multilayer thin-film fabrication
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