This nickel (Ni) sputtering target is a 99.9% pure disc measuring 6'' across and 0.250'' thick, intended for depositing thin nickel films by sputtering. In this process, material is eroded from the target and transferred onto a substrate such as a silicon wafer.
Sputter deposition works with substrates of many shapes and sizes and gives repeatable results. A process developed on a small research and development scale can be scaled up to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Although the number of variables makes sputtering a complex technique, it gives experienced users considerable control over film growth and microstructure.
- Deposition of thin nickel films onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Material analysis by controlled etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect trace impurities.
- Research and development work that can later be scaled up to medium and large substrate areas.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.9% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI26
- Material: Nickel (Ni)
- Size: 6''
- Thickness: 0.250''
- Product code: NG0ST01NI26
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