Nickel (Ni) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD) sputtering processes. During sputtering, energetic ions bombard the target surface and eject nickel atoms that condense onto a substrate to form a thin, uniform film. As a transition metal target, nickel belongs to the metal sputtering target group used in thin-film research and coating development.
- 1 piece
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- Deposition of nickel seed and adhesion layers in microelectronics research
- Fabrication of magnetic thin films for data storage and sensor studies
- Preparation of electrode and contact layers for electronic and electrochemical devices
- Protective and decorative coatings on metal and glass substrates
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