This nickel vanadium (NiV) sputtering target from Nanografi is a source material for depositing thin films by sputtering. It has a purity of 99.95%, a size of 1'' and a thickness of 0.250'', and is supplied as a single piece.
In sputter deposition, material is eroded from the target and deposited onto a substrate such as a silicon wafer. The technique works with substrates of many shapes and sizes, gives repeatable results, and can move from small research and development work to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions can take place on the target surface, in flight or on the substrate. The large number of adjustable parameters makes sputtering a complex process, but it gives experienced users considerable control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers by sputtering.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Analytical work in which material is etched away, as in secondary ion mass spectrometry (SIMS) to determine composition and detect very low impurity levels.
- Studies related to space weathering, where sputtering alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI79
- Material: Nickel Vanadium (NiV)
- Size: 1''
- Thickness: 0.250''
- Product code: NG0ST01NI79
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