This nickel vanadium (NiV) sputtering target is a 4'' source material with a thickness of 0.250'' and a purity of 99.95%. It is designed for sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established way to coat substrates of many shapes and sizes with thin films. The process gives repeatable results and scales from small research and development work up to production batches covering medium to large substrate areas.
Depending on the process settings, chemical reactions can take place on the target surface, in flight or on the substrate. Because so many parameters can be tuned, experienced users gain considerable control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers by sputtering.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Materials analysis by etching away target material, as in secondary ion mass spectrometry (SIMS).
- Scalable coating work from research and development projects to medium and large area production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01NI85
- Material: Nickel Vanadium (NiV)
- Size: 4''
- Thickness: 0.250''
- Product code: NG0ST01NI85
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