This silicon dioxide (SiO2) sputtering target is made of fused quartz with a purity of 99.995%. It measures 3'' in size with a thickness of 0.250'' and is supplied as a single piece for sputter deposition systems.
Sputtering deposits thin films by eroding material from a target and transferring it onto a substrate, such as a silicon wafer. The method works with many substrate shapes and sizes, gives repeatable results, and scales from small R&D work up to production batches covering medium to large substrate areas.
Depending on process settings, reactions may take place at the target surface, in flight, or on the substrate. The number of adjustable parameters makes the process complex, but it gives experienced users close control over film growth and microstructure.
- Thin film deposition of silicon dioxide onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Materials analysis methods such as secondary ion mass spectrometry (SIMS), where sputtered atoms are measured to determine composition and trace impurities.
- Research into space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.995% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI70
- Material: Silicon Dioxide (SiO2), Fused Quartz
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01SI70
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