This silicon dioxide (SiO2) sputtering target is made of fused quartz with a purity of 99.995%. It measures 4'' in size and 0.125'' in thickness, and is supplied as a single piece for depositing thin films by sputtering.
Sputter deposition works by eroding material from the target and transferring it onto a substrate such as a silicon wafer. The method suits many substrate shapes and sizes, gives repeatable results and can move from small research and development work to production batches covering medium to large substrate areas.
Depending on process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. Although the large number of variables makes sputtering a complex technique, it gives experienced users considerable control over film growth and microstructure.
- Thin film deposition of silicon dioxide onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not critical.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS), where sputtered atoms are identified and quantified to reveal composition and trace impurities.
- Research into space weathering processes that alter airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.995% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI71
- Material: Silicon Dioxide (SiO2), Fused Quartz
- Size: 4''
- Thickness: 0.125''
- Product code: NG0ST01SI71
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