This silicon dioxide (SiO2) sputtering target is made of fused quartz with a purity of 99.995%. It measures 4'' in size with a thickness of 0.250'' and serves as the source material for depositing SiO2 thin films by sputtering.
Sputter deposition works by eroding material from the target onto a substrate, such as a silicon wafer, and can coat substrates of many shapes and sizes. The process is repeatable, suiting small research and development work as well as production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. Although the number of variables makes sputtering a complex technique, it gives experienced users fine control over film growth and microstructure.
- Deposition of silicon dioxide thin films onto substrates such as silicon wafers.
- Sputter etching where a high degree of etching anisotropy is required and selectivity is not a concern.
- Analytical work such as secondary ion mass spectrometry (SIMS), where material is sputtered at a constant rate to determine composition and detect trace impurities.
- Research into space weathering, the sputtering process that alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.995% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI72
- Material: Silicon Dioxide (SiO2), Fused Quartz
- Size: 4''
- Thickness: 0.250''
- Product code: NG0ST01SI72
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