This silicon dioxide (SiO2) sputtering target is made of fused quartz with a purity of 99.995%. It measures 8'' in size with a thickness of 0.250'' and is supplied as a single piece for depositing thin films by sputtering.
In sputter deposition, material is eroded from the target and deposited onto a substrate such as a silicon wafer. The method works with many materials and with substrates of varied shapes and sizes. It gives repeatable results and scales from small research and development work to production batches covering medium to large substrate areas.
Depending on process settings, chemical reactions may take place at the target surface, in flight or on the substrate. The many adjustable parameters make sputtering a complex technique, but they give experienced users close control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research and development work that can be scaled up to production batches over medium to large substrate areas.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.995% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI76
- Material: Silicon Dioxide (SiO2), Fused Quartz
- Size: 8''
- Thickness: 0.250''
- Product code: NG0ST01SI76
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