Silicon sputtering targets are solid plates of silicon used as the source material in physical vapor deposition (PVD) processes. During sputtering, atoms are ejected from the target surface and deposited onto a substrate to form thin films. This P-type variant is silicon doped with acceptor impurities, so its majority charge carriers are holes. It belongs to the group of semiconductor sputtering materials used in thin-film research and device fabrication.
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- Deposition of silicon-based thin films for semiconductor device research
- Fabrication of layers for thin-film and photovoltaic solar cell studies
- Prototyping of MEMS and microsensor structures
- Surface and interface studies on doped silicon thin films
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