This P-type silicon (Si) sputtering target is a 2'' disc, 0.125'' thick, with a purity of 99.999%. It serves as the source material for depositing silicon thin films by sputtering onto substrates such as silicon wafers.
Sputter deposition works with many material types and substrate geometries. Because the process is repeatable, work started at research and development scale can be carried over to medium and large substrate areas in production batches. Depending on the process settings, chemical reactions may take place at the target surface, in flight, or on the substrate. The large number of adjustable parameters gives experienced users fine control over film growth and microstructure.
Beyond deposition, sputtering targets are also used in sputter etching and in surface analysis methods that remove material from the target at a controlled rate.
- Deposition of silicon thin films onto substrates such as silicon wafers.
- Sputter etching where strong etching anisotropy is required and selectivity is not critical.
- Material analysis such as secondary ion mass spectrometry (SIMS), where sputtered atoms are identified and quantified to reveal composition and trace impurities.
- Research into space weathering processes affecting airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI21
- Material: Silicon (Si)
- Type: P-type
- Size: 2''
- Thickness: 0.125''
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