This P-type silicon (Si) sputtering target is a 2'' target with a thickness of 0.250'' and a purity of 99.999%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes. Processes built around sputter targets are repeatable and can grow from small R&D work to production batches covering medium to large substrate areas. Depending on process settings, chemical reactions may take place on the target surface, in flight or on the substrate itself.
Because sputter deposition involves many adjustable parameters, it gives experienced users considerable control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity levels.
- Research into space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI22
- Material: Silicon (Si)
- Type: P-type
- Size: 2''
- Thickness: 0.250''
- Product code: NG0ST01SI22
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