This undoped silicon (Si) sputtering target from Nanografi has a purity of 99.999%, a size of 2'' and a thickness of 0.250''. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established thin film technique that works with many materials and with substrates of different shapes and sizes. The process is repeatable, suits small research and development work, and can be scaled to production batches covering medium to large substrate areas.
Depending on process conditions, chemical reactions may take place at the target surface, in flight or on the substrate. The large number of adjustable parameters gives experienced users considerable control over film growth and microstructure.
- Deposition of thin films onto substrates such as silicon wafers by sputtering.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), to determine composition and detect trace impurities.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI38
- Material: Silicon (Si), undoped
- Size: 2''
- Thickness: 0.250''
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