This undoped silicon (Si) sputtering target from Nanografi has a purity of 99.999%, a diameter of 3'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established, repeatable thin film technique that works with substrates of many shapes and sizes. A process developed in small research projects can be scaled up to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place on the target surface, in flight or on the substrate, and the many adjustable parameters give experienced users fine control over film growth and microstructure.
Beyond deposition, sputtering targets are also used in sputter etching and in analytical methods such as secondary ion mass spectrometry (SIMS).
- Deposition of silicon thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Compositional analysis by SIMS, where the sputtered atoms are identified by mass spectrometry and very low impurity levels can be detected.
- Scaling deposition processes from research and development work to medium and large substrate production batches.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI39
- Material: Silicon (Si), undoped
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST01SI39
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