This undoped silicon (Si) sputtering target from Nanografi is a 3'' disc, 0.250'' thick, with a purity of 99.999%. It serves as the source material in sputter deposition systems, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established method for coating substrates of many shapes and sizes. The process is repeatable, works for small research and development projects, and can be scaled to production batches covering medium to large substrate areas. Depending on the process settings, chemical reactions may take place at the target surface, in flight or on the substrate.
Because sputter deposition involves many adjustable parameters, it gives experienced users a high degree of control over film growth and microstructure.
- Deposition of silicon thin films onto substrates such as silicon wafers.
- Sputter etching where strong etching anisotropy is required and selectivity is not critical.
- Material analysis by etching, as in secondary ion mass spectrometry (SIMS), where sputtered atoms are identified and quantified to determine composition and trace impurities.
- Research into space weathering, in which sputtering alters the physical and chemical properties of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.999% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SI40
- Material: Silicon (Si), undoped
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01SI40
—
—