Silicon (Si) sputtering targets are solid plates of elemental silicon used as the source material in physical vapor deposition (PVD). During sputtering, atoms are ejected from the target surface and deposited onto a substrate to form a thin film. This product is undoped, meaning no intentional dopant elements have been added. Silicon is a group IV element and a foundational material in semiconductor manufacturing, so sputtering targets of this type are commonly selected when researchers need a silicon source for controlled film growth on wafers, glass, or other substrates.
- Quantity: 1 piece
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- Deposition of silicon thin films for semiconductor device research
- Reactive sputtering of silicon nitride or silicon dioxide dielectric layers
- Optical and anti-reflective coating development
- Thin-film fabrication for MEMS and microsensor research
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