This tantalum (Ta) sputtering target from Nanografi is an elastomer-type target with a purity of 99.95%, a diameter of 2'' and a thickness of 0.125''. It serves as the source material for depositing thin tantalum films by sputtering onto substrates of many shapes and sizes.
Sputter deposition is a well-established and repeatable technique. It works for small research and development projects and can be scaled up to production batches covering medium to large substrate areas. Depending on process parameters, chemical reactions may take place at the target surface, in flight or on the substrate.
Because the process has many adjustable parameters, it is complex, but it gives experienced users close control over film growth and microstructure.
- Thin film deposition, where material eroded from the target is deposited onto a substrate such as a silicon wafer.
- Sputter etching in semiconductor work where high etching anisotropy is required and selectivity is not a concern.
- Material analysis such as secondary ion mass spectrometry (SIMS), in which sputtered atoms are measured to determine composition and detect very low impurity levels.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TA12
- Material: Tantalum (Ta)
- Type: Elastomer
- Size: 2''
- Thickness: 0.125''
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