This Nanografi tantalum (Ta) sputtering target has a purity of 99.95%, a size of 1'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where atoms are eroded from the target and laid down as a thin film on a substrate such as a silicon wafer.
Sputtering works with many materials and with substrates of different shapes and sizes. The process is repeatable, suits small research and development work, and can be scaled to production batches covering medium to large substrate areas.
Depending on process settings, chemical reactions may take place at the target surface, in flight or on the substrate. The number of adjustable parameters makes sputtering complex, but it gives experienced users close control over film growth and microstructure.
- Deposition of thin tantalum films onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not a concern.
- Material analysis by secondary ion mass spectrometry (SIMS), where sputtered atoms are identified to determine composition and detect trace impurities.
- Research into space weathering processes that alter airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TA01
- Material: Tantalum (Ta)
- Size: 1''
- Thickness: 0.125''
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