This tantalum (Ta) sputtering target from Nanografi has a purity of 99.95%, a size of 1'' and a thickness of 0.250''. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film on a substrate such as a silicon wafer.
Sputtering is an established and repeatable way to coat many different substrate shapes and sizes. A process developed in small research and development work can be scaled up to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or at the substrate. The number of adjustable parameters makes sputter deposition complex, but it gives experienced users close control over film growth and microstructure.
- Deposition of tantalum thin films onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Analytical work that removes material by sputtering, such as secondary ion mass spectrometry (SIMS) for determining composition and detecting trace impurities.
- Scaling deposition processes from research and development to medium and large substrate areas.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TA02
- Material: Tantalum (Ta)
- Size: 1''
- Thickness: 0.250''
- Product code: NG0ST01TA02
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