This tantalum (Ta) sputtering target from Nanografi is a 3'' target with a thickness of 0.250'' and a purity of 99.95%. It serves as the source material in sputter deposition, where atoms are eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering is an established way to coat substrates of many shapes and sizes with thin films. The process is repeatable, works for small research and development projects, and can be scaled to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place at the target surface, in flight or on the substrate. The large number of adjustable parameters makes sputtering a complex technique, but it gives experienced users fine control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers.
- Sputter etching where highly anisotropic etching is required and selectivity is not critical.
- Surface analysis such as secondary ion mass spectrometry (SIMS), where sputtered atoms are identified to determine composition and trace impurities.
- Studies related to space weathering of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01TA06
- Material: Tantalum (Ta)
- Size: 3''
- Thickness: 0.250''
- Product code: NG0ST01TA06
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