Tantalum (Ta) sputtering targets are solid metal sources used in physical vapor deposition (PVD). Under ion bombardment in a vacuum chamber, tantalum atoms are ejected from the target and deposited onto a substrate to form thin films. Tantalum belongs to the refractory transition metals, known for its chemical stability, corrosion resistance, and the stable oxide layers it can form.
- 1 piece
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- Diffusion barrier layers in microelectronics research
- Thin-film capacitor and resistive layer development
- Protective and corrosion-resistant coatings on components
- Optical and functional thin-film studies
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