A tin (Sn) sputtering target is a solid source material used in physical vapor deposition (PVD) to produce thin films. During sputtering, energetic ions bombard the target surface, ejecting tin atoms that condense onto a substrate. Tin is a metallic element, so this target belongs to the metal sputtering target group, and it can be used in metallic or reactive deposition processes.
- Quantity: 1 piece
Contact AMI Scientific for technical specifications, CoA, or a quotation.
- Thin-film deposition research for electronic and semiconductor devices
- Preparation of tin-based and tin oxide films in reactive sputtering studies
- Coating development for optical and surface-functional layers
- Process optimization and calibration in university and industrial laboratories
| Brand | — |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | — |
| Category | — |
| Pack sizes | — |
| Physical form | — |
| Storage | — |
—
—