This tin (Sn) sputtering target from Nanografi is an elastomer-type target with 99.99% purity, a size of 3'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where material eroded from the target forms a thin film on a substrate such as a silicon wafer.
Sputtering can coat substrates of many shapes and sizes and gives repeatable results. A process developed in small research and development work can be scaled up to production batches covering medium to large substrate areas. Depending on the process settings, chemical reactions may take place at the target surface, in flight or on the substrate.
Because sputter deposition involves many adjustable parameters, experienced users have considerable control over the growth and microstructure of the deposited film.
- Deposition of tin thin films onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Material analysis by etching, such as secondary ion mass spectrometry (SIMS), to determine composition and detect very low impurity concentrations.
- Research related to space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.99% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SN16
- Material: Tin (Sn)
- Type: Elastomer
- Size: 3''
- Thickness: 0.125''
- Product code: NG0ST01SN16
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