Tin (Sn) sputtering targets are solid metallic source materials used in physical vapor deposition (PVD). During sputtering, energetic ions bombard the target surface and eject tin atoms, which then condense onto a substrate to form a thin film. Tin is a post-transition metal, and its targets are widely used in thin-film research where a controlled, uniform metallic layer is required.
- Quantity: 1 piece
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- Thin-film deposition research for electronic and semiconductor device prototyping
- Studies of lead-free solder and metallization layers
- Development of optical and protective coatings
- Materials science research on alloy and multilayer film formation
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