Tin (Sn) sputtering targets are solid metal plates used as the source material in physical vapor deposition (PVD) sputtering systems. Tin is a post-transition metal, and its sputtering targets are used to deposit thin metallic films onto substrates. With reactive gases such as oxygen or nitrogen, they can also form tin-based oxide or nitride films.
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- Reactive sputtering of tin oxide thin films for transparent conductive and gas-sensing layer research
- Metallization and solderable coatings for electronic device prototyping
- Deposition of thin films for optical and decorative coating studies
- Fundamental studies of thin-film growth, interface, and alloy formation
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