This tin (Sn) sputtering target from Nanografi has a purity of 99.95%, a size of 2'' and a thickness of 0.125''. It serves as the source material in sputter deposition, where material is eroded from the target and deposited as a thin film onto a substrate such as a silicon wafer.
Sputtering can coat a wide range of substrate shapes and sizes. The process is repeatable, so work that starts in small research and development projects can be scaled to production batches covering medium to large substrate areas.
Depending on the process parameters, chemical reactions may take place on the target surface, in flight or on the substrate. Because so many parameters are involved, sputter deposition is a complex technique, but it gives experienced users fine control over film growth and microstructure.
- Thin film deposition onto substrates such as silicon wafers.
- Sputter etching where high etching anisotropy is required and selectivity is not a concern.
- Analytical work such as secondary ion mass spectrometry (SIMS), where sputtered atoms are measured to determine composition and detect very low impurity levels.
- Studies related to space weathering, in which sputtering alters the surfaces of airless bodies such as asteroids and the Moon.
| Brand | Nanografi |
|---|---|
| CAS number | — |
| Molecular formula | — |
| Purity | 99.95% |
| Category | — |
| Pack sizes | 1 piece |
| Physical form | — |
| Storage | — |
- Product code: NG0ST01SN04
- Material: Tin (Sn)
- Size: 2''
- Thickness: 0.125''
- Product code: NG0ST01SN04
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